1.Jianbing Zang, Jing Lu, Xuehai Qi, Yanhui Wang*. Characterization of silicon films grown by atomic layer deposition on nanocrystalline diamond. Diamond and related materials, 2006, 15(9): 1434-1437. (SCI, WOS: 000240047300039, IF:2.561)
2.Jing Lu, Yanhui Wang, Jianbing Zang*, Y.N. Li. Protective silicon coating for nanodiamonds using atomic layer deposition. Applied surface science, 2007, 253(7): 3485-3488.(SCI, WOS:000244381700022, IF=3.387)
3.Jing Lu, JianBing Zang, Shan S X, H. Huan, Yanhui Wang*. Synthesis and characterization of core− shell structural MWNT− zirconia nanocomposites. Nano letters, 2008, 8(11): 4070-4074.(SCI, WOS: 000260888600092, IF=12.712)
4.Jianbing Zang, Jing Lu, Yanghui Wang, Jinhui Zhang, X.Z. Cheng, H. Huang. Fabrication of core–shell structured MWCNT–Ti(TiC) using a one-pot reaction from a mixture of TiCl3, TiH2, and MWCNTs. Carbon, 2010, 48(13): 3802-3806. (SCI, WOS: 000281190800018, IF= 6.337)
5.陆静, 罗求发, 宋运运, 胡光球,徐西鹏. 凝胶结合剂超细金刚石磨粒工具的制备及应用. 机械工程学报, 2015, 51(15):205-212. (EI,Accession number: 20153701258946)
6.Jing Lu, Yang Li, Xipeng Xu*. The effects of abrasive yielding on the polishing of SiC wafers using asemi-fixed flexible pad. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2015, Vol. 229(S1) 170-177. (SCI, WOS: 000352579400013, IF=1.366)
7.Yang Li, Jing Lu*, and Xipeng Xu. Phase transformation of monocrystalline silicon induced by polishing with diamond abrasives. IEEE Transactions on Semiconductor Manufacturing, 2015, 28(2): 153-159. (SCI, WOS: 00035418940000, IF=1.117)
8.Jing Lu*, Jianbing Zang, Yanhui Wang, Yongchao Xu, Xipeng Xu. Preparation and characterization of zirconia-coated nanodiamonds as a Pt catalyst support for methanol electro-oxidation. Nanomaterials, 2016, 6: 234. (SCI, WOS: 000392240000013, IF=3.553)
9.Qiufa Luo, Jing Lu*, Xipeng Xu. A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools. Wear, 2016, 350-351: 99-106. (SCI, WOS: 000370535900013, IF=2.531)
10.Yongchao Xu, Jing Lu*, Xipeng Xu. Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing. Applied Surface Science, 2016, 389: 713-720. (SCI, WOS: 000384577600087, IF=3.387)
11.Qiufa Luo, Jing Lu*, Xipeng Xu. Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools. Tribology International, 2016, 104: 191-203. (SCI, WOS: 000386186500019, IF=2.903)
12.Jing Lu*, Qiufa Luo, Xianyan Mao, Xipeng Xu, Yanhui Wang, Hua Guo. Fabrication of a resin-bonded ultra-fine diamond abrasive polishing tool by electrophoretic co-deposition for SiC processing. Precision Engineering, 2017, 47: 353-361. (SCI, WOS: 000389090200035, IF=2.237)
13.Jing Lu*, Yaguang Wang, Qiufa Luo, Xipeng Xu. Photocatalysis assisting the mechanical polishing of a single-crystal SiC wafer utilizing an anatase TiO2-coated diamond abrasive. Precision Engineering, 2017, 49: 235-242. (SCI, WOS: 000402444000024, IF=2.237 )
14.Jing Lu*, Yongchao Xu, Yunhe Zhang, Xipeng Xu. The effects of SiO2 coating on diamond abrasives in sol-gel tool for SiC substrate polishing. Diamond and Related Materials, 2017, 76: 123-131. (SCI, WOS: 000403858500019, IF=2.561)(51475175, 20133501130001, ZQN-YX202).
15.Jing Lu*, Yongchao Xu, Dayu Zhang, Xipeng Xu. The synthesis of the core/shell structured diamond/akageneite hybrid particles with enhanced polishing performance. Materials, 2017, 10: 673. (SCI, WOS: 000404415000107, IF=2.654)
16.Qiufa Luo, Jing Lu*, Xipeng Xu, Feng Jiang. Removal mechanism of sapphire substrates (0001, 11-20 and 10-10) in mechanical planarization machining. Ceramics International, 2017, 43: 16178-16184. (SCI, WOS:000414106600020,IF=2.986 )
17.Jing Lu, Qiufa Luo, Xipeng Xu, Hui Huang, Feng Jiang. Removal mechanism of 4H- and 6H-SiC substrates (0001 and 000-1) in mechanical planarization machining. Proceedings of the Institution of Mechanical Engineers Part B-Journal of Engineering Manufacture, 2019, 233(1) 69-76.